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  1. Al-V alloys produced via high-energy ball milling have been reported to show simultaneous improvement of corrosion resistance and mechanical properties compared to traditional Al alloys. In these alloys, V content plays a crucial role in increasing or decreasing the corrosion resistance. Therefore, the effect of V and microstructure on corrosion of high-energy ball milled and subsequently spark plasma sintered Al-xV alloys (x = 2, 5, 10 at%) has been studied. Cyclic potentiodynamic polarization tests and electrochemical impedance spectroscopic analysis revealed the increment of V content up to 5 at% enhanced the corrosion resistance of the alloy. However, highly heterogeneous microstructure in Al-10 at%V resulted in significant localized corrosion over the immersion time. The electrochemical impedance spectroscopy studies over 14 days of immersion revealed underlying corrosion mechanisms.

     
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  2. Nanocrystalline supersaturated Al-V alloys produced by high-energy ball milling have been reported to exhibit enhanced corrosion resistance and mechanical properties compared to commercial Al alloys. Corrosion of passive alloys such as Al-V alloy relies on the characteristics of the surface film, which is studied using scanning/transmission electron microscopy and time-of-flight secondary ion mass spectrometry. The effect of microstructure and composition on the surface film has been investigated after different immersion periods (30 min, 2 h, and 1 day) in 0.1 M NaCl. The surface film was complex and composed of oxidized Al and V. The heterogeneous surface film was observed due to the presence of secondary phases and initiation of localized corrosion. The void formation was observed beneath the surface film that would potentially cause pitting corrosion. The generation of nano-sized voids was dependent on grain orientation. Compared to pure Al, the chloride penetration is suppressed in Al-V alloys. The effect of composition and microstructure on surface film formation and attendant corrosion behavior is discussed herein.

     
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